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Jesd22 b116 PDF results

Jedec standards

Jedec standards for a more complete list of standards, pls see http:www.jedec.org packaging: handling/using moisture sensitive devices, etc. j-std-020 joint ipc/jedec standard for moisture/reflow sensitivity classification for nonhermetic solid state surface-mount devices this document identifies the classification level of nonhermetic solid-state... jesd22-b116 wire bond shear test this document establishes a standard procedure for determining the strength of an integrated circuit's wire bond by...

This is the summary of changes to mil-std-883 for revision h ...

This is the summary of changes to mil-std-883 for revision h ry 28, 2010 no. section of change paragraph to be changed description of change justification for change page(s) changed 1 forward 2 comment change the assist web address from: http://assist.daps.dla.mi l to: https://assist.daps.dla.m il Under eia listings change add eia/jesd22-b116, wire bond shear test this document has been added as a reference to tm-2011. dscc 4 6 main body 2.3...

Advanced bond testing solutions

Dage 4000 |standards ey/ ak0 5/ 0 8 dage 4000 advanced bond testing solutions quick release intelligent load cartridge system results repeatability guaranteed automation features local language operator screens advanced electronics and software control dage 4000 global presence, global support, local care with 6 direct offices and representatives... Cbp/hbp jeitaeiaj et-7407 bga bump shear jedec jesd22-b117 au ball shear jedec jesd22-b116 ball bond shear astm f1269 wire pull dt/ndt mil std 883 die shear mil...

Bondtester

Irrespective of the industry: semiconductors, or the various microelectronics sectors of automotive, power, hybrid, or high reliability, the nordson dage 4000plus has the versatility and accuracy which gives its users total confidence in the quality of their products. it features the latest patented bond testing technology, for example the anti... Bga bump shear jedec jesd22-b117a cold bump pull jedec jesd22-b115 au ball shear jedec jesd22-b116 ball bond shear astm f1269 wire pull dt/ndt...

Process qualification report

Process qualification report process: skyworks hbt4, 6-inch product & package reliability 5221 california avenue, irvine, ca 92617 skyworks newbury park 6-in hbt4 process qualification, qual-csr-08-00001-02 page 2 of 12 form sq04-0091 skyworks solutions, inc. table of contents 1 summary… jesd22-b116. 10 bonds/die. 3 die/lot 2 lots. refer to figure 4 and table 1 in jesd22-b116 (> 8.1 g) str9392: >12.2 g. str9396: >22.4 g. str9397: > 20.2 g...

This is a preview - click here to buy the full publication ...

Iec/pas 62686-1 edition 1.0 2011-04 publicly available specification pre-standard process management for avionics - aerospace qualified electronic components (aqec) - part 1: general requirements for high reliability integrated circuits and discrete semiconductors international electrotechnical jesd22-b106, resistance to soldering heat jesd22-b107, marking permanency jesd22-b116, wire bond shear test jesd24, power mosfets this is a preview...

Freescale copper wire - analysis, results and implementation

Freescale copper wire - analysis, results and implementation dr. stephen lee, trent uehling, dr. leo higgins iii 1 25-april 2011 since the end of 2009, the semiconductor industry has seen a sharp increase in the use of copper as a bonding wire. by the end of 2010, the installed base of copper wire capable bonders approached 25%... ... customers will be seeing an stress test reference test conditions minimum sample size (note 1) # of lots results lot id-(#rej/ss) na=not applicable wbs jesd22 b116...

Product/process change notice (pcn)

Integrated device technology, inc. 6024 silver creek valley road san jose, ca 96138 pcn #: a0903-04 date: means of distinguishing changed devices: product affected: 9 mm x 9 mm vfqfpn-64 product mark 10 mm x 10 mm vfqfpn-72 back mark date code date effective: jesd22-a104 1 44/0 wire bond pull test mil-std-883 m2001 5/0 ball shear test jesd22-b116 attachment 1 - pcn # : a0903-04 * high accelerated stress test

Performance innovation industry standard test methods

Being able to meet the requirements of industry standard test methods is a vital requirement of all components, products and systems. www.celestica.com performance innovation - industry standard test methods | 1 performance innovation industry standard test methods at celestica, we not only have the capability and expertise... ... and use of moisture sensitive • surface mount devices (pb-free) • j-std-035: acoustical microscopy (c-sam) • jesd22-b109: flip chip tensile pull test • jesd22-b116...

650 one page flyer 01 ja 070830

System features - motorized height controlled microscope that stays in focus as it moves - 305 mm x 155 mm stage for 300 mm wafers, leadframes or substrates - ultra fine pitch (ufp) capable - image capture option which is field upgradeable. - ribbon bond testing for standard to high -end power devices International standards mil std 883, mil std 750, astm f1269, jesd22-b117, jesd22- b116 and ce certified. lead free rohs compliant. mainframe...

9213 dage series4000

An exciting development to meet a growing demand for bond testing within an industry where emerging technologies and diversifying applications are now commonplace. as the market leader we have an ongoing policy to listen to feedback from our global support network and customers, and take up the Bga bump shear jedec jesd22-b117 au ball shear jedec jesd22-b116 ball bond shear astm f1269 wire pull dt/ndt mil std 883 die shear mil std 883

Dupont product/presentation title

Improved thermal performance with polyimide based laminate substrates gary briney, david sutton, and dan amey dupont electronic technologies september 14, 2006 for further information please contact michael.j.green{??at??}us a.dupont.com 9/27/2006 3 patent pending thermal management and performance• has always been important in electronics... ... breakdown voltage per ipc-tm-650 2.5.6.3 copper adhesion - peel strength per ipc-tm-650 2.4.9 thermal conductivity - per astm e1461 wire bond shear per jesd22-b116...

Enig vs. enep (g) under bump metallization for lead-free wl-csp ...

Enig vs. enep (g) under bump() pmetallization for lead-free wl-csp solder bumps -a comparison of intermetallic properties using high speed pull test imaps international conference on device packaging imaps international conference on device packaging march, 17-20, 2008 -scottsdale, az dr. thorsten teutsch pac tech-packaging technologies usa, inc. Ni/pd/all ni/pd/au+ plasma clean ni/au ni/pd/au from jedecspecs eia/jesd22-b116 certified iso 9001: 2000 & iso ts 16949 confidential p still...

Click to edit master title style

C abstract click to edit master title style the utilization of electroless nickel/gold as alow cost under bump metallization for flip-chip and wafer-level csp application is meanwhile well established in the industry.•click to edit master text styles•second level pp yhowever, new technical requirements and challenges are producing strong... ... ni/pd/au+ plasma clean second level •third level fthll ni/au ni/pd/au •fourth level •fifth level certified din en iso 9001 pac tech usa from jedec specs eia/jesd22-b116

System features

System features- motorized height controlled microscope that stays in focus as it moves- 305 mm x 155 mm stage for 300 mm wafers, leadframes or substrates- ultra fine pitch (ufp) capable- image capture option which is field upgradeable.- ribbon bond testing for standard to high-end power devices- world language support- small foot print with built... ... 1 micron over 25 micron travel loop height measurement yes force profile yes international standards mil std 883, mil std 750, astm f1269, jesd22-b117, jesd22- b116...

Qualification # date issued qual

Rfpa1012 production qualification report qlt-05324, rev a.2 page 1 of 2 for additional information please contact your rfmd customer quality engineer form qal-04-1049 rev c product description high linearity driver amplifier packaged in a 2x2mm 8-pin dfn package Un‐biased, 96 hours, jesd22‐a102c 30 x 1 lot pass wire bond shear (bs) jesd22‐b116, ppk>1.66 or cpk>1.33 10x 1 lot pass

Jedec

Index of terms and abbreviations defined in jedec publications (revision of jep120) jedec solid state technology association jedec standards and publications contain material that has been prepared, reviewed, and approved through the jedec board of directors level and subsequently reviewed and approved jesd22-b116…2.4.3 creepage distance… jesd4...

Bourns thyristor surge protectors

Thyristor surge protectors tsp0903 revised bourns manufacturers representatives corporate distributor product managers americas sales team asia sales team europe sales team may 6, 2009 pcn tracking number 48 change from gold to copper wire in 2q08, bourns qualifi ed a change to the base metal composition of... Thb 85 °c/85 %rh, 1000 h jesd22 a101 129/1 45/- 45/- 45/ t cycle 65/+150 °c, 200 cs mil std 883 2031 129/1 45/- 45/- 45/ ball shear strength >100 g jesd22 b116...

Product/process change notice (pcn)

Integrated device technology, inc. 6024 silver creek valley road san jose, ca 96138 pcn #: a-0610-01 date : means of distinguishing changed devices: product affected: product mark back mark date code date effective: other contact: mary vesey attachment: yes no title: director, product assurance Solderability test jesd22-b102d mil-std-883, m 2011 mil-std-883, m 2015 jesd22-b116 45/0 ss / rej 5/0 jesd22-b101 25/0 jesd22-a103-b 25/0 45/0

Product/process change notice (pcn)

Integrated device technology, inc. 6024 silver creek valley road, san jose, ca - 95138 pcn #: a-0607-06 date: means of distinguishing changed devices: product affected: plcc, soic 150 mil/300 mil product mark(standard package) back mark refer to attachment ii for the affected part numbers. date code date effective: other contact: geoffrey cortes ... plcc 68l notes: * test requires moisture pre-conditioning sequence per jesd22-a113.... pull test mil-std-883, m2011 35/0 35/0 jesd 22-a102 45/0 77/0 ball shear test jesd 22-b116...

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